Single-side ground alumina piezo ceramic substrate

Views: 1 Author: Site Editor Publish Time: 2018-10-10 Origin: Site

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By adding a rust inhibitor, the alumina piezo ceramic substrate can be effectively prevented from becoming yellowish after polishing, and the polishing effect is not affected. Therefore, in the high-efficiency thinning and ultra-smooth polishing of alumina piezo ceramic substrates, it is possible to add a rust inhibitor to the grinding,polishing liquid is to obtain a good process surface and avoid defects in the appearance and performance.The material removal rate of the single-side grinding is using the cast iron grinding is the highest, and the material removal rate of the single-side grinding is using the piezo ceramic grinding is the worst. The material removal rate of the diamond abrasive in the single-side grinding method is 4.6 times that of the double-side grinding. The higher material removal rate causes more damage to the piezo ceramic surface, so the surface roughness Ra of the diamond obtained by single-sided grinding is also higher. Compared with the single-side grinding on the piezo ceramic grinding , the material removal rate after single-side grinding on the cast iron grinding disc is as high as 7.1 m/min, which is 7.1 times that of the former, while the surface roughness of the abrasive sheet is lower than the former.

On the one hand, in order to remove the abrasive into between the grinding disc and the workpiece, HIFU piezo ceramics have the effect of recycling the abrasive, it is necessary to groove the grinding piezo surface, and different groove structures have different effects on the grinding processing effect. The cast iron piezo disc surface adopts a fine annular groove. The groove of this structure can keep the polishing liquid on the grinding disc surface to a large extent without escaping, and there are more abrasive particles at the same slurry flow rate. It acts on the grinding workpiece to make the surface material removal rate higher after grinding; while the piezo ceramic grinding disc surface adopts the structure of the cross groove, the groove of this structure allows most of the abrasive to fill inside the groove and rotate with the grinding disc. In the grinding action area, only a small amount of abrasive acts between the grinding piezo surface and the grinding workpiece, so that only a small amount of abrasive particles act on the grinding workpiece at the same slurry flow rate, so that the surface material removal rate after grinding is low.On the other hand, the cast iron piezo disc is softer than the grinding workpiece. The abrasive is mainly embedded in the surface of the cast iron grinding disc to perform micro-cutting removal on the grinding workpiece. The removal rate of HIFU piezo transducer surface material is high, and the removal mechanism has a damage area on the surface. the surface roughness Ra after grinding is lower; while the ceramic disk is harder than the abrasive workpiece, the abrasive mainly produces three-body rolling friction between the grinding disk and the workpiece, and the removal rate of surface material is low.

The damage area generated on the surface is large, and the surface roughness Ra after polishing is also high. For the high intensity focused piezo surface hole region, regions 2, 3 and 4 are ceramic surface regions, which are impurity regions of the piezo ceramic surface. The surface of the alumina piezo ceramic does not contain Fe element, which indicates that the surface of the alumina piezo ceramic has no iron or corresponding contaminant residue after single-side grinding on the cast iron grinding disc; it can be seen that the surface area of the alumina piezo ceramic does not contain Fe element. It is said that iron which migrates from the surface of the cast iron grinding disc to the surface of the piezo ceramic substrate, and yellow contaminants which are chemically applied and covered on the piezo ceramic surface are mechanically removed and escaped by grinding. It can be seen that the white matter-like impurities are distinct from the polished alumina piezo ceramic surface, and are impurities that have not been thoroughly removed and cleaned, and the element types contained therein contain Mg, Si and Fe elements in addition to the O and Al elements. Impurities can be removed by subsequent grinding and polishing processes and ultrasonic cleaning.

Therefore, there is no yellowing on the surface of the HIFU piezoelectric element substrate after single-side grinding.It is considered that during the single-side grinding process, the iron is escaping from the cast iron grinding disc migrates to the piezo ceramic through the flow of the polishing liquid.On the surface of the substrate, chemical action occurs to form yellow contaminants and cover the surface of the piezo ceramic.There is a certain rate of formation, and the abrasive particles are also removed from the surface of the piezo ceramic substrate during the grinding process. when the material removal rate is greater or equal to the rate of yellow contaminants.It will be removed and escaped at the same time as it is generated. In addition, the piezo ceramic surface holes do not have iron or its corresponding contaminants, and the chemical action is prevented from occurring in the subsequent processing and application of the alumina piezo ceramic substrate, which affects the performance. Therefore, the single-side grinding process with a higher removal rate can solve the problem of yellowing of the surface of the alumina piezo ceramic substrate. Since the abrasive material has the strongest removal effect and is more suitable for single-side grinding, the solution is suitable for single-side grinding with diamond as the abrasive.