Study on Grinding and Polishing Process of Alumina Piezo Ceramic Substrate

With the rapid development of optoelectronic technology and microelectronic technology,it is more and more urgent for the electronic piezo ceramics to use under the harsh environment,including high temperature, high humidity, electric strength, high radiation intensity. As commonly used materials in electronic ceramic,AlzO} ceramics has many excellent characteristics,like high temperature resistance, corrosion resistance, high mechanical strength, high hardness, high electric insulation performance and low dielectric loss,etc. A1z03 ceramics has received wide attention and research with a broad application prospect in the aspects of machinery electronics, electronic power, biological medicine and amation. A1z03 ceramic materials manufacturing technology mainly includes the preparation of ceramic substrate technology,and ceramic substrate surface of the cutting and processing technology. The two parts are essential for the forming and using of substrate, in which the surface of the substrate processing technology is the foundation and guarantee of the electronic components production. Because of high hardness and brittleness, easy to produc cracks, difficult to surface processing, it is difficult for AIzO} ceramics substrate to guarante the quality and integrity of surface and subsurface. And the surface process of A1z03 piezoelectric ceramic material not only requires high dimensional and shape accuracy, low surface roughness anc good surface integrity, but also requires ultra smooth surface without defects and damage fc the application of A1z03 ceramic substrate. Therefore,for the substrate material preparation technology,it is the key and development trend to realize surface ultra smooth and flat of A1z03 ceramic substrate.

 The impact of the processing parameters on efficient thinning and super-smooth polishing of A1z03 piezoceramic tube transducer substrate was studied systematically in this paper. The systematical experiment of A1z03 ceramic substrate was conducted,using the single-side and double-side grinding and polishing equipment.The effects of the processing methods, the type of abrasive, abrasive particle size, lapping pressure and lapping plate speed, grinding fluid flow and the concentration of abrasive grinding fluid on the efficient thinning of A1z03 ceramic substrate were analyzed,and process parameters were optimized. Under the condition of the same process parameters, the effects of single-sided and double-sided polishing on polishing efficiency and surface roughness of AIzO} ceramic substrate were studied comparatively. The test results show that the single-sided grinding and polishing processing method can obtain higher Pzt material piezoceramic transducer removal efficiency and better surface.processing quality.